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A Method and Tool for Early Design/Technology Search-Space Exploration for 3D ICs
 
K. Siozios, A. Papanikolaou and D. Soudris
IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC), pp. 359-364, Oct. 2008, Rhodes, Greece.
 
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Abstract:
3D integration is the big next step in system integration. It is still an emerging technology though and its implications on die and packages are not fully understood yet. Furthermore, it comes in many different process flavors. Adoption by mainstream designers requires the availability of tools that let them evaluate the cost and benefits of 3D compared to conventional system implementations. In this paper we propose a software-supported framework for system prototyping on 3D ICs. Also, we provide a case study scenario for realizing and evaluating a system implementing MPEG4 encoding on a 3D IC. The results show that 3D integration provides significant improvements among others in delay, power/energy consumption, as well as die area, compared to conventional 2D implementations.

Last Update: 09 October 2016